Semiconductor structure and manufacturing method thereof

ABSTRACT

A semiconductor structure includes a first device and a second device. The first device includes a plate including a plurality of apertures, a membrane disposed opposite to the plate and including a plurality of corrugations facing the plurality of apertures, and a conductive plug extending from the plate through the membrane. The second device includes a substrate and a bond pad disposed over the substrate, wherein the conductive plug is bonded with the bond pad to integrate the first device with the second device, and the plate is an epitaxial (EPI) silicon layer or a silicon-on-insulator (SOI) substrate.

BACKGROUND

Electronic equipment involving semiconductive devices are essential for many modem applications. The semiconductive device has experienced rapid growth. Technological advances in materials and design have produced generations of semiconductive devices where each generation has smaller and more complex circuits than the previous generation. In the course of advancement and innovation, functional density (i.e., the number of interconnected devices per chip area) has generally increased while geometric size (i.e., the smallest component that can be created using a fabrication process) has decreased. Such advances have increased the complexity of processing and manufacturing semiconductive devices.

Micro-electro mechanical system (MEMS) devices have been recently developed and are also commonly involved in electronic equipment. The MEMS device is micro-sized device, usually in a range from less than 1 micron to several millimeters in size. The MEMS device includes fabrication using semiconductive materials to form mechanical and electrical features. The MEMS device may include a number of elements (e.g., stationary or movable elements) for achieving electro-mechanical functionality. MEMS devices are widely used in various applications. MEMS applications include motion sensors, pressure sensors, printer nozzles, or the like. Other MEMS applications include inertial sensors, such as accelerometers for measuring linear acceleration and gyroscopes for measuring angular velocity. Moreover, MEMS applications are extended to optical applications, such as movable mirrors, and radio frequency (RF) applications, such as RF switches or the like.

As technologies evolve, design of the devices becomes more complicated in view of small dimension as a whole and increase of functionality and amounts of circuitries. The devices involve many complicated steps and increases complexity of manufacturing. The increase in complexity of manufacturing may cause deficiencies such as high yield loss, warpage, low signal to noise ratio (SNR), etc. Therefore, there is a continuous need to modify structure and manufacturing method of the devices in the electronic equipment in order to improve the device performance as well as reduce manufacturing cost and processing time.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is emphasized that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1 is a schematic view of a semiconductor structure in accordance with some embodiments of the present disclosure.

FIG. 2 is an exploded view of a semiconductor structure in accordance with some embodiments of the present disclosure.

FIG. 3 is a cross-sectional view of a semiconductor structure in accordance with some embodiments of the present disclosure.

FIG. 4 is a cross-sectional view of a monolithic sensor in accordance with some embodiments of the present disclosure.

FIG. 5 is a flow diagram of a method of manufacturing a semiconductor structure in accordance with some embodiments of the present disclosure.

FIG. 5A is a cross-sectional view of a first substrate in accordance with some embodiments of the present disclosure.

FIG. 5B is a cross-sectional view of a plate including an epitaxial (EPI) silicon layer in accordance with some embodiments of the present disclosure.

FIG. 5C is a cross-sectional view of a plate including a silicon-on-insulator (SOI) substrate or polysilicon-oxide-silicon substrate in accordance with some embodiments of the present disclosure.

FIG. 5D is a cross-sectional view of a first sacrificial oxide layer disposed over a first substrate in accordance with some embodiments of the present disclosure.

FIG. 5E is a cross-sectional view of several recesses disposed over a first sacrificial oxide layer in accordance with some embodiments of the present disclosure.

FIG. 5F is a cross-sectional view of a membrane disposed over a first sacrificial oxide layer in accordance with some embodiments of the present disclosure.

FIG. 5G is a cross-sectional view of a second sacrificial oxide layer disposed over a membrane and a first sacrificial oxide layer in accordance with some embodiments of the present disclosure.

FIG. 5H is a cross-sectional view of several vias passing through a first sacrificial oxide layer and a second sacrificial oxide layer in accordance with some embodiments of the present disclosure.

FIG. 5I is a cross-sectional view of several conductive plugs passing through a first sacrificial oxide layer and a second sacrificial oxide layer in accordance with some embodiments of the present disclosure.

FIG. 5J is a cross-sectional view of a semiconductor structure without a first substrate in accordance with some embodiments of the present disclosure.

FIG. 5K is a cross-sectional view of a semiconductor structure disposed over another substrate in accordance with some embodiments of the present disclosure.

FIG. 5L is a cross-sectional view of a patterned plate in accordance with some embodiments of the present disclosure.

FIG. 5M is a cross-sectional view of a semiconductor structure with a membrane movable relative to a plate in accordance with some embodiments of the present disclosure.

FIG. 6 is a flow diagram of a method of manufacturing a semiconductor structure in accordance with some embodiments of the present disclosure.

FIG. 6A is a cross-sectional view of a first substrate in accordance with some embodiments of the present disclosure.

FIG. 6B is a cross-sectional view of a plate including an epitaxial (EPI) silicon layer in accordance with some embodiments of the present disclosure.

FIG. 6C is a cross-sectional view of a plate including a silicon-on-insulator (SOI) substrate or polysilicon-oxide-silicon substrate in accordance with some embodiments of the present disclosure.

FIG. 6D is a cross-sectional view of a first sacrificial oxide layer disposed over a first substrate in accordance with some embodiments of the present disclosure.

FIG. 6E is a cross-sectional view of several recesses disposed over a first sacrificial oxide layer in accordance with some embodiments of the present disclosure.

FIG. 6F is a cross-sectional view of a membrane disposed over a first sacrificial oxide layer in accordance with some embodiments of the present disclosure.

FIG. 6G is a cross-sectional view of a second sacrificial oxide layer disposed over a membrane and a first sacrificial oxide layer in accordance with some embodiments of the present disclosure.

FIG. 6H is a cross-sectional view of several vias passing through a first sacrificial oxide layer and a second sacrificial oxide layer in accordance with some embodiments of the present disclosure.

FIG. 6I is a cross-sectional view of several conductive plugs passing through a first sacrificial oxide layer and a second sacrificial oxide layer in accordance with some embodiments of the present disclosure.

FIG. 6J is a cross-sectional view of a second device in accordance with some embodiments of the present disclosure.

FIG. 6K is a cross-sectional view of a partially removed passivation in accordance with some embodiments of the present disclosure.

FIG. 6L is a cross-sectional view of a protective layer disposed over a second device in accordance with some embodiments of the present disclosure.

FIG. 6M is a cross-sectional view of an additional oxide layer disposed over a protective layer in accordance with some embodiments of the present disclosure.

FIG. 6N is a cross-sectional view of several bond pads exposed from a protective layer and an additional oxide layer in accordance with some embodiments of the present disclosure.

FIG. 60 is a cross-sectional view of a first device bonded with a second device in accordance with some embodiments of the present disclosure.

FIG. 6P is a cross-sectional view of a semiconductor structure without a first substrate in accordance with some embodiments of the present disclosure.

FIG. 6Q is a cross-sectional view of a patterned plate in accordance with some embodiments of the present disclosure.

FIG. 6R is a cross-sectional view of a semiconductor structure with a membrane movable relative to a plate in accordance with some embodiments of the present disclosure.

DETAILED DESCRIPTION OF THE DISCLOSURE

The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

Microphone is an electronic equipment. The microphone is an acoustic sensor that converts variation of air pressure such as acoustic pressure or sound wave into electrical signals. The microphone can involve a MEMS device. The MEMS device includes a stationary plate allowing the acoustic pressure passing through and a movable membrane disposed above the plate and responding to the acoustic pressure. The movement or oscillation of the membrane creates a change in an amount of capacitance between the membrane and the plate. The amount of change would then be translated into an electrical signal accordingly. Since the plate and the membrane have small thickness, there is a surface tension or so called “stiction” between the plate and the membrane. The membrane would be easily stuck with the plate by the stiction, which would induce noise, decrease the SNR or even cause failure of the membrane, and therefore lower sensitivity of the membrane. A performance of the microphone would be affected.

Furthermore, upon manufacturing of the MEMS device, the membrane is initially suspended in a sacrificial oxide layer and then is released to become movable relative to the plate by partial removal of the sacrificial oxide layer. A tensile stress on the membrane would be developed by the sacrificial oxide layer during the manufacturing. Such residual tensile stress would cause undesired deflection of the membrane and thus decrease the sensitivity of the membrane.

In addition, the microphone can also involve an active device such as complementary metal oxide semiconductor (CMOS) device. The active device can integrate with the MEMS device by suitable operations such as wire bonding. However, the integration would induce parasitical capacitance and result in a high noise, a low SNR and poor performance of the microphone.

In the present disclosure, a microphone with an improved semiconductor structure is disclosed. The semiconductor structure includes a MEMS device. The MEMS device includes a plate and a membrane. The plate is stationary while the membrane is moveable relative to the plate in response to an acoustic pressure such as a sound wave striking on the membrane. The plate of the MEMS device includes an epitaxial (EPI) silicon layer, a polysilicon-oxide-silicon substrate, or a silicon-on-insulator (SOI) substrate. The plate including the EPI silicon layer, polysilicon-oxide-silicon substrate or SOI substrate is very thin while has sufficient rigidity for resisting residual stress developed during manufacturing and the acoustic pressure striking thereon. As such, the plate would not have undesired bending and a straightness of the plate can be maintained during manufacturing or during use. Thus, a noise is reduced, the SNR is increased. The performance of the microphone is improved.

Furthermore, the plate and the membrane are supported by a handle substrate (such as silicon substrate) during formation of the plate and the membrane. A thickness of the handle substrate is much greater than a thickness of the plate and the membrane. The handle substrate would be removed after formation of the plate and the membrane and bonding with another substrate such as CMOS substrate. As a result, an overall thickness of the device is reduced. A form factor of the microphone is also reduced.

FIG. 1 is a schematic perspective view of a semiconductor structure 100 in accordance with some embodiments of the present disclosure. The semiconductor structure 100 includes a plate 101, a membrane 102 and a conductive plug 103. FIG. 2 is an exploded view of the semiconductor structure 100, which illustrates the plate 101 and the membrane 102. FIG. 3 is a schematic cross sectional view of the semiconductor structure 100.

In some embodiments, the semiconductor structure 100 is configured to sense an acoustic pressure such as sound wave. In some embodiments, the semiconductor structure 100 is a part of a microphone. The acoustic pressure is received by the semiconductor structure 100 and then is converted into an electrical signal. In some embodiments, the semiconductor structure 100 is a MEMS device including electro-mechanical elements. In some embodiments, the semiconductor structure 100 is miniaturized and has a small form factor. In some embodiments, the semiconductor structure 100 has a thickness of about less than 100 um. In some embodiments, the semiconductor structure 100 has a thickness of less than about 20 um. In some embodiments, the semiconductor structure 100 is disposed over and bonded with another substrate.

In some embodiments, the semiconductor structure 100 includes the plate 101, the membrane 102 and the conductive plug 103. In some embodiments, the plate 101 is a stationary element and served as a back plate of the semiconductor structure 100. The plate 101 is not movable by the acoustic pressure received by the semiconductor structure 100. In some embodiments, the plate 101 is a stiff perforated element which allows the acoustic pressure passing through.

In some embodiments, the plate 101 has a small thickness while has sufficient stiffness to resist residual stress developed upon manufacturing and the acoustic pressure striking thereon. In some embodiments, the plate 101 has stiffness such that the plate 101 would not be bent when the acoustic pressure is received by the semiconductor structure 100 and passes through the plate 101. In some embodiments, the plate 101 would not be bent by the stiction caused by the membrane 102 disposed opposite to the plate 101. The straightness of the plate 101 is maintained.

In some embodiments, the plate 101 is doped with suitable dopants to include several doped regions. In some embodiments, the plate 101 is doped with a p-type dopant such as boron or an n-type dopant such as phosphorous. In some embodiments, the plate 101 uses the same type of dopant to prevent p-n junction and have better conductivity.

In some embodiments, the plate 101 includes an anti-stiction coating disposed over the plate 101. In some embodiments, the anti-stiction coating is a self-assembled monolayer (SAM) coating which can prevent or reduce stiction between the plate 101 and the membrane 102. In some embodiments, the plate 101 is in circular, rectangular, quadrilateral, triangular, hexagon, or any other suitable shapes.

In some embodiments, the plate 101 includes an epitaxial (EPI) silicon layer. In some embodiments, the plate 101 has a thickness of about 1 um to about 20 um. The plate 101 is thin while has stiffness to resist the residual stress upon manufacturing and the acoustic pressure striking thereon. The plate 101 is prevented from deflection during use and manufacturing. In some embodiments, the plate 101 has stiffness such that the plate 101 would not be bent when the acoustic pressure is received by the semiconductor structure 100 and passes through the plate 101. In some embodiments, the plate 101 would not be bent by the stiction caused by the membrane 102 disposed opposite to the plate 101. The straightness of the plate 101 is maintained.

In some embodiments, the plate 101 includes a silicon-on insulator (SOI) substrate. In some embodiments, the SOI substrate includes a silicon layer on an insulator such as silicon oxide, glass, etc. In some embodiments, the plate 101 has a thickness of about 0.3 um to about 20 um. The plate 101 is thin while has stiffness to resist the residual stress upon manufacturing and the acoustic pressure striking thereon. The plate 101 is prevented from deflection during use and manufacturing. In some embodiments, the plate 101 has stiffness such that the plate 101 would not be bent when the acoustic pressure is received by the semiconductor structure 100 and passes through the plate 101. In some embodiments, the plate 101 would not be bent by the stiction caused by the membrane 102 disposed opposite to the plate 101. The straightness of the plate 101 is maintained.

In some embodiments, the plate 101 includes several apertures 101 a. Each of the apertures 101 a passes through the plate 101. In some embodiments, the apertures 101 a are configured for the acoustic pressure received by the semiconductor structure 100 passing through. The apertures 101 a can relieve a stress on the plate 101 caused by the acoustic pressure, such that the plate 101 would not be bent by the acoustic pressure. Furthermore, the apertures 101 a are configured to prevent the membrane 102 sticking with the plate 101 by the acoustic pressure and the stiction between the plate 101 and the membrane 102.

In some embodiments, the apertures 101 a are arranged in a regular or an irregular array over the plate 101. In some embodiments, the apertures 101 a are arranged in any suitable patterns. In some embodiments, the aperture 101 a is in a circular, quadrilateral, elliptical, triangular, hexagon, or any other suitable shapes. In some embodiments, the aperture 101 a has a width of about 0.5 um to about 5 um. In some embodiments, a pitch between adjacent apertures 101 a is about 1 um to about 100 um. In some embodiments, a total number of the apertures 101 a, the pitch between adjacent apertures 101 a or the width of each aperture 101 a is predetermined and designed, so that the plate 101 would not be bent by the acoustic pressure received and the stiction between the plate 101 and the membrane 102, and the straightness of the plate 101 can be maintained.

In some embodiments, the membrane 102 is disposed opposite to the plate 101. In some embodiments, the membrane 102 is disposed under the plate 101. In some embodiments, the membrane 102 is disposed away from the plate 101 in a distance of about 0.5 um to about 5 um, or about 0.3 um to about 5 um. In some embodiments, the membrane 102 is in circular, rectangular, quadrilateral, triangular, hexagon, or any other suitable shapes. In some embodiments, the membrane 102 includes polysilicon. In some embodiments, the membrane 102 is conductive and capacitive. In some embodiments, the membrane 102 is supplied with a predetermined charge. In some embodiments, the membrane 102 includes an anti-stiction coating disposed over the membrane 102 to prevent or reduce a stiction between the plate 101 and the membrane 102. In some embodiments, the anti-stiction coating is a SAM coating. In some embodiments, the membrane 102 has a thickness of about 0.1 um to about 5 um, or about 0.3 um to about 5 um.

In some embodiments, the membrane 102 is a movable or oscillateable element. The membrane is displaceable relative to the plate 101 and is served as a diaphragm. In some embodiments, the membrane 102 is displaceable within a cavity 104. In some embodiments, the membrane 102 is configured to sense the acoustic pressure received by the semiconductor structure 100. The membrane 102 is sensitive to the acoustic pressure. When the acoustic pressure is impinged on the membrane 102, the membrane 102 would be displaced or oscillated 101 corresponding to the acoustic pressure impinged on the membrane 102. In some embodiments, a magnitude and/or a frequency of the displacement of the membrane 102 corresponds to a volume and/or pitch of the acoustic pressure impinged on the membrane 102.

In some embodiments, the displacement of the membrane 102 relative to the plate 101 would cause a capacitance change between the membrane 102 and the plate 101. The capacitance change would then be translated into an electrical signal by a circuitry connected with the plate 101 and the membrane 102. In some embodiments, the acoustic pressure impinged on the membrane 102 is converted into the electrical signal representing the acoustic pressure impinged on the membrane 102. In some embodiments, the electrical signal generated would be transmitted to another device, another substrate or another circuitry for further processing.

In some embodiments, the membrane 102 includes several corrugations 102 a. The corrugations 102 a are arranged over the membrane 102. In some embodiments, the corrugations 102 a face to and are opposite to the apertures 101 a of the plate 101. In some embodiments, the corrugations 102 a are substantially aligned or not aligned with the apertures 101 a of the plate 101. In some embodiments, the corrugations 102 a are protruded or recessed from a surface of the membrane 102. In some embodiments, the corrugation 102 a is a groove extending across the surface of the plate 101. In some embodiments, the corrugation 102 a is a protruded portion or a recessed portion of the surface of the plate 101. In some embodiments, the corrugation 102 a is a bump on the plate 101.

In some embodiments, the corrugations 102 a are configured to relieve undesired stress over the membrane 102. In some embodiments, the corrugations 102 a prevent the membrane 102 from sticking with the plate 101 caused by stiction between the plate 101 and the membrane 102. In some embodiments, the corrugations 102 a prevent undesired deflection of the membrane 102. The corrugations 102 a can facilitate the membrane 102 to return to its initial straight configuration after receiving and bending by the acoustic pressure. When the membrane 102 is displaced by the acoustic pressure, the membrane 102 would be bent. After the receipt of the acoustic pressure, it is desirable the membrane 102 would be returned to the initial straight configuration.

In some embodiments, the corrugation 102 a is in a closed loop, a quadrilateral ring, an annular shape, an elliptical shape or any other suitable configurations. In some embodiments, the corrugation 102 a has a width of about 0.1 um to about 10 um. In some embodiments, a pitch between adjacent corrugations 102 a is about 1 um to about 200 um. In some embodiments, there are a number of corrugations 102 a disposed on the membrane 102. For example, there are two annular corrugations 102 a as illustrated in FIG. 2.

In some embodiments, the shape, the width, the pitch or the number of the corrugations 102 a is predetermined and designed, so that the membrane 102 would not have undesired bending. In some embodiments, the shape, the width or the number of the corrugations 102 a is chosen to optimize the straightness and the sensitivity of the membrane 102. The membrane 102 can sense the acoustic pressure accurately and promptly, and can be returned to the initial straight configuration after sensing the acoustic pressure.

In some embodiments, the membrane 102 includes several holes 102 b over the membrane 102. In some embodiments, the holes 102 b are configured to relieve undesired stress over the membrane 102. In some embodiments, the holes 102 b can prevent or minimize the membrane 102 from sticking with the plate 101 by stiction between the plate 101 and the membrane 102. In some embodiments, the holes 102 b are substantially aligned or not aligned with the apertures 101 a. In some embodiments, a total number of holes 102 b is chosen, so that the membrane 102 would not have undesired bending. In some embodiments, a total number of holes 102 b are less than a total number of the apertures 101 a over the plate 101. In some embodiments, the total number of the holes 102 b is chosen to optimize the straightness and the sensitivity of the membrane 102. The membrane 102 can sense the acoustic pressure accurately and promptly, and can be returned to the initial straight configuration after sensing the acoustic pressure. Also, the membrane 102 can be prevented from sticking with the plate 101 by stiction.

In some embodiments, the conductive plug 103 extends from the plate 101. In some embodiments, the conductive plug 103 extends from the plate 101 and is passes through the membrane 102. In some embodiments, the conductive plug 103 supports the plate 101 and/or the membrane 102. In some embodiments, the conductive plug 103 electrically connects the plate 101 and/or the membrane 102 with a circuitry. In some embodiments, the conductive plug 103 includes polysilicon. In some embodiments, the conductive plug 103 has a height from the plate 101 of about 5 um to about 20 um. In some embodiments, the conductive plug 103 has a height from the membrane 102 of about 2 um to about 20 um. In some embodiments, the conductive plug 103 and the plate 101 define the cavity 104, such that the membrane 102 can be displaced or vibrated within the cavity 104.

In some embodiments, the conductive plug 103 includes a standing off pad 103 a disposed over the conductive plug 103. In some embodiments, the standing off pad 103 a is a protruded portion of the conductive plug 103 and is configured to facilitate bonding of the conductive plug 103 with another substrate or external circuitry, so that the semiconductor structure 100 bonds with and electrically connects with another substrate or external circuitry. In some embodiments, the standing off pad 103 a includes polysilicon. In some embodiments, the standing off pad 103 a has a height of about 1 um to about 10 um.

In some embodiments, the conductive plug 103 includes a semiconductor material 103 b disposed over the conductive plug 103. In some embodiments, the semiconductor material 103 b includes germanium, gold, tin, silicon or other suitable materials. In some embodiments, the semiconductor material 103 b is disposed over the standing off pad 103 a. The semiconductor material 103 b is configured to facilitate bonding of the conductive plug 103 with a bond pad on another substrate.

In some embodiments, the semiconductor structure 100 includes an oxide 105 disposed around the conductive plug 103 and a peripheral portion of the membrane 102. In some embodiments, the oxide 105 surrounds the membrane 102. In some embodiments, the oxide 105 is protected and surrounded by the conductive plug 103, the standing off pad 103 a and the plate 101. In some embodiments, the oxide 105 surrounds the periphery of the membrane 102. In some embodiments, the oxide 105 is configured by a protection ring surrounding the periphery of the membrane 105. In some embodiments, the oxide 105 isolates the plate 101, the membrane 102 and the conductive plug 103 from each other. In some embodiments, the oxide 105 provides support to the plate 101 and/or the membrane 102.

FIG. 4 is a cross-sectional view of a monolithic sensor 300 in accordance with some embodiments of the present disclosure. In some embodiments, the monolithic sensor 300 is configured for sensing an acoustic pressure. In some embodiments, the monolithic sensor 300 includes a device integrated with another device. In some embodiments, the monolithic sensor 300 is included in a microphone.

In some embodiments, the monolithic sensor 300 includes a first device 100 and a second device 200. In some embodiments, the first device 100 is the semiconductor structure 100 as described above. In some embodiments, the first device 100 is a MEMS device. In some embodiments, the first device 100 includes a plate 101, a membrane 102, a conductive plug 103, a first cavity 104 and an oxide 105, which have similar configuration as described above and/or as illustrated in FIGS. 1-3.

In some embodiments, the second device 200 is an active device. In some embodiments, the second device is a CMOS device. In some embodiments, the second device 200 includes a substrate 201 and a bond pad 202. In some embodiments, the substrate 201 is a CMOS substrate. In some embodiments, the substrate 201 includes CMOS component and circuitry. In some embodiments, the bond pad 202 is disposed over the substrate 201. In some embodiments, the bond pad 202 is configured to receive an external interconnect structure so that the circuitry of the substrate 201 can electrically connect with another substrate or another device. In some embodiments, the bond pad 202 includes aluminum, copper, tin or gold.

In some embodiments, the second device 200 includes a passivation 203 disposed over the substrate 201. In some embodiments, the passivation 203 includes dielectric material, silicon oxide, silicon nitride, etc. In some embodiments, the passivation 203 surrounds the bond pad 202. The bond pad 202 is partially exposed from the passivation 203. In some embodiments, the bond pad 202 is recessed from a top surface of the passivation 203. In some embodiments, the passivation 203 is disposed away from the membrane 102 of the first device 100 in a distance of about 1 um to about 10 um, about 0.3 um to about 10 um, or about 0.3 um to about 5 um.

In some embodiments, the first device 100 is integrated with the second device 200. In some embodiments, the first device 100 is flipped and disposed over the second device 200. The first device 100 having the plate 101 facing upward and the conductive plug 103 facing downward is integrated with the second device 200. In some embodiments, the conductive plug 103 of the first device is bonded with the bond pad 202 of the second device 200 to integrate the first device 100 with the second device 200. In some embodiments, a standing off pad 103 a of the first device 100 or a semiconductive material 103 b on the standing off pad 103 a is disposed over and bonded with the bond pad 202 of the second device 200. In some embodiments, the monolithic sensor 300 has a height of about 300 um to about 500 um after the bonding and the integration of the first device 100 and the second device 200.

In some embodiments, the second device 200 includes a protective layer 205 disposed conformal to the top surface of the passivation 203 facing the first device 100. In some embodiments the protective layer 205 is configured to protect the passivation 203 or other components disposed over the second substrate 106 from being etched away. In some embodiments, the protective layer 205 is configured to prevent the passivation 203 or other components disposed over the second substrate 106 from being attacked by hydrofluoric (HF) acid vapor. In some embodiments, the protective layer 205 includes aluminum oxide (Al₂O₃). In some embodiments, the bond pad 202 is exposed from the protective layer 205.

In some embodiments, the second device 200 includes a second cavity 204 disposed over the first cavity 104 of the first device 100 and passed through the substrate 201 and the passivation 203. In some embodiments, the second cavity 204 is coupled with the first cavity 104. In some embodiments, the second cavity 204 is aligned with the corrugations 102 a of the membrane 102 and/or the apertures 101 a of the plate 101. In some embodiments, the second cavity 204 has a sidewall 204 a covered by the protective layer 205. In some embodiments, the sidewall 204 a is a sloped portion of the top surface of the passivation 203.

In some embodiments, the second cavity 204 is configured to receive an acoustic pressure. The acoustic pressure can travel and pass through the second cavity 204 so as to impinge on the membrane 102. When the acoustic pressure is impinged on the membrane 102, the membrane 102 would be displaced or oscillated within the first cavity 104. The displacement of the membrane 102 varies a capacitance between the plate 101 and the membrane 102, thereby an electrical signal is generated. In some embodiments, the capacitance change is transmitted to the CMOS device 200 through the conductive plug 103 and the bond pad 202, and then the electrical signal is generated by the CMOS device 200. The displacement of the membrane 102 by the acoustic pressure entering from the second cavity 204 and impinged on the membrane 102 is converted into the electrical signal by the CMOS device 200. In some embodiments, the acoustic pressure can pass through the apertures 101 a and the holes 102 b to relieve the acoustic pressure after sensing the acoustic pressure.

In the present disclosure, a method of manufacturing a semiconductor structure is also disclosed. In some embodiments, a semiconductor structure is formed by a method 500. The method 500 includes a number of operations and the description and illustration are not deemed as a limitation as the sequence of the operations.

FIG. 5 is an embodiment of a method 500 of manufacturing a semiconductor structure. The method 500 includes a number of operations (501, 502, 503, 504, 505, 506, 507, 508, 509 and 510).

In operation 501, a first substrate 106 is received or provided as shown in FIG. 5A. In some embodiments, the first substrate 106 is a handle substrate or a handle wafer. In some embodiments, the first substrate 106 includes silicon. In some embodiments, the first substrate 106 facilitates a formation of a MEMS device thereon. In some embodiments, the first substrate 106 is a silicon substrate. In some embodiments, the first substrate has a thickness of about 400 um to about 1000 um.

In operation 502, a plate 101 is disposed over the first substrate 106 as shown in FIGS. 5B and 5C. In some embodiments, the plate 101 has a thickness of about 0.3 um to about 20 um. In some embodiments, the plate 101 is doped with suitable dopants such as a p-type dopant or an n-type dopant by in-situ doping, implantation or thermal diffusion. In some embodiments, the plate 101 uses the same type of dopant to prevent p-n junction and have better conductivity.

In some embodiments, the plate 101 is an EPI silicon layer as shown in FIG. 5B. In some embodiments, the plate 101 includes a buried oxide layer 101-1 and a SOI substrate 101-2 disposed over the buried oxide layer 101-1 as shown in FIG. 5C. In some embodiments, the buried oxide layer 101-1 includes silicon oxide. In some embodiments, the buried oxide layer 101-1 has a thickness of about 0.5 um to about 5 um. In some embodiments, the SOI substrate 101-2 has a thickness of about 0.3 um to about 20 um. In some embodiments, the plate 101 includes polysilicon-oxide-silicon substrate 101-2 and has a thickness of about 0.3 um to about 20 um. In some embodiments, the plate 101 is deposited with polysilicon and has a thickness of about 0.3 um to about 20 um.

In operation 503, a first sacrificial oxide layer 105 a is disposed over the plate 101 as shown in FIG. 5D. In some embodiments, the first sacrificial oxide layer 105 a is disposed by any suitable deposition techniques such as chemical vapor deposition (CVD) and the like. In some embodiments, the first sacrificial oxide layer 105 a includes dielectric material such as silicon oxide. In some embodiments, the first sacrificial oxide layer 105 a has a thickness of about 0.3 um to about 5 um.

In operation 504, several recesses 105 c are formed over a surface of the first sacrificial oxide layer 105 a as shown in FIG. 5E. In some embodiments, the recesses 105 c are indented from the surface of the first sacrificial oxide layer 105 a. In some embodiments, some portions of the first sacrificial oxide layer 105 a are removed from the surface to form the recesses 105 c. In some embodiments, the recesses 105 c are formed by photolithography and wet or dry etching operations.

In operation 505, a membrane 102 is disposed and then patterned over the first sacrificial oxide layer 105 a as shown in FIG. 5F. In some embodiments, the membrane 102 is disposed over the first sacrificial oxide layer 105 a by any suitable deposition operations. In some embodiments, the membrane 102 includes polysilicon. In some embodiments, the membrane 102 is doped with any suitable dopants. In some embodiments, the membrane 102 has a thickness of about 0.3 um to about 5 um.

In some embodiments, the membrane 102 is patterned by photolithography and etching operations after the deposition operations, so that several corrugations 102 a and several holes 102 b are formed over the membrane 102. In some embodiments, some portions of the membrane 102 are removed to form the holes 102 b. The holes 102 b expose a portion of the first sacrificial oxide layer 105 a.

In operation 506, a second sacrificial oxide layer 105 b is disposed over the a portion of the first sacrificial oxide layer 105 a (exposed through the holes 102 b) and surrounding the membrane 102 as shown in FIG. 5G. In some embodiments, the second sacrificial oxide layer 105 b is disposed over the membrane 102 and the first sacrificial oxide layer 105 a by any suitable deposition operations. In some embodiments, the second sacrificial oxide layer 105 b includes same or different materials as the first sacrificial oxide layer 105 a. In some embodiments, the second sacrificial oxide layer 105 b includes dielectric material such as silicon oxide. In some embodiments, the second sacrificial oxide layer 105 b has a thickness of about 0.3 um to about 5 um. In some embodiments, the second sacrificial oxide layer 105 b is planarized to a reduced height than as deposited. In some embodiments, the second sacrificial oxide layer 105 b is polished by chemical mechanical polishing (CMP) operations.

In operation 507, several conductive plugs 103 are formed as shown in FIGS. 5H and 51. In some embodiments, several vias 105 d passing through the first sacrificial oxide layer 105 a or the second sacrificial oxide layer 105 b are formed as shown in FIG. 5H. In some embodiments, the vias 105 d are formed by any suitable operation such as photolithography and etching. In some embodiments, some of the first sacrificial oxide layer 105 a or the second sacrificial oxide layer 105 b are removed and stopped at the plate 101 to form the vias 105 d.

In some embodiments, the vias 105 d are deposited and filled by semiconductive materials such as polysilicon to form several conductive plugs 103 as shown in FIG. 5I. In some embodiments, the conductive plugs 103 pass through the first sacrificial oxide layer 105 a or the second sacrificial oxide layer 105 b. In some embodiments, the conductive plug 103 is extended from the plate 101 through the membrane 102. In some embodiments, the conductive plug 103 is extended from or through the membrane 102.

In some embodiments, the conductive plugs 103 are formed by removing some portions of the first sacrificial oxide layer 105 a or the second sacrificial oxide layer 105 b and then disposing polysilicon. In some embodiments, some portions of the first sacrificial oxide layer 105 a or the second sacrificial oxide layer 105 b are removed by photolithography and etching operations. In some embodiments, the polysilicon is disposed by any suitable deposition operations. The conductive plug 103 includes polysilicon. In some embodiments, the conductive plug 103 has a height of about 1 um to about 5 um. After formation of the conductive plugs 103, the conductive plugs 103 are planarized by any suitable polishing operations such as CMP operations.

In some embodiments, several standing off pads 103 a are formed over the conductive plugs 103 respectively. In some embodiments, additional polysilicon is disposed over the second sacrificial oxide layer 105 b and the conductive plugs 103, and then some portions of the additional polysilicon are removed by photolithography and etching operations to form the standing off pads 103 a. In some embodiments, the standing off pad 103 a has a height of about 1 um to about 10 um.

In some embodiments, several semiconductive materials 103 b are disposed over the standing off pads 103 a respectively. In some embodiments, the semiconductive materials 103 b such as germanium are disposed over the conductive plugs 103 a. In some embodiments, the semiconductive materials 103 b are disposed by any suitable operations such as sputtering.

In operation 508, the first substrate 106 is removed as shown in FIGS. 5J and 5K. In some embodiments, the first substrate 106 is removed by any suitable operations such as grinding, etching, etc. In some embodiments, the first substrate 106 is removed by wet etching or dry etching. In some embodiments, the first substrate 106 is ground several times to thin down its thickness. In some embodiments, the first substrate 106 is etched in several times. In some embodiments, the first substrate 106 is ground or etched until reaching the plate 101. In some embodiments, the first substrate 106 is flipped before the grinding or etching operations. In some embodiments, the operation 508 is performed after bonding the first substrate 106 with another substrate as shown in FIG. 5K. In some embodiments, the operation 508 is performed after bonding the conductive plugs 103 with another substrate. The first substrate 106 is supported by another substrate, and then the operation 508 is implemented and the first substrate 106 is thinned down or removed.

In operation 509, the plate 101 is patterned as shown in FIG. 5L. In some embodiments, the plate 101 is patterned to form several apertures 101 a over the plate 101. In some embodiments, the apertures 101 a pass through the plate 101 to expose the first sacrificial oxide layer 105 a. In some embodiments, some portions of the plate 101 are removed by photolithography and etching operations to form the apertures 101 a. In some embodiments, the apertures 101 a are formed opposite to the corrugations 102 a of the membrane 102.

In operation 510, the first sacrificial oxide layer 105 a and the second sacrificial oxide layer 105 b are removed as shown in FIG. 5M. In some embodiments, the first sacrificial oxide layer 105 a and the second sacrificial oxide layer 105 b are removed by etching operations such as wet etching. In some embodiments, the buried oxide layer 101-1 is also removed together with the first sacrificial oxide layer 105 a and the second sacrificial oxide layer 105 b. In some embodiments, a first cavity 104 is formed after removing the first sacrificial oxide layer 105 a and the second sacrificial oxide layer 105 b. In some embodiments, the first cavity 104 is aligned with the corrugations 102 a of the membrane 102.

In some embodiments, some portions of the first sacrificial oxide layer 105 a and the second sacrificial oxide layer 105 b are remained. The remained first sacrificial oxide layer 105 a and the second sacrificial oxide layer 105 b acting as an oxide 105 to surround the conductive plugs 103. In some embodiments, the plate 101 and the membrane 102 are supported by the conductive plugs 103 and the oxide 105. In some embodiments, a semiconductor structure 100 is formed. The semiconductor structure 100 has similar configuration as in any one of FIGS. 1-4. In some embodiments, the plate 101, the membrane 102, the conductive plug 103 and the oxide 105 have similar configuration as in any one of FIGS. 1-4.

The membrane 102 is displaceable relative to the plate 101 after the removal of the first sacrificial oxide layer 105 a and the second sacrificial oxide layer 105 b. In some embodiments, the membrane 102 is configured to sense an acoustic pressure. When the membrane 102 is displaced by an acoustic pressure, the displacement of the membrane 102 relative to the plate 101 is converted into an electrical signal corresponding to a magnitude and frequency of the displacement.

FIG. 6 is an embodiment of a method 600 of manufacturing a monolithic sensor. The method 600 includes a number of operations (601, 602, 603, 604, 605, 606, 607, 608, 609, 610, 611, 612, 613 and 614).

In operation 601, a first substrate 106 is received or provided as shown in FIG. 6A. The operation 601 is similar to the operation 501 in FIG. 5A. In operation 602, a plate 101 is disposed as shown in FIGS. 6B and 6C. The operation 602 is similar to the operation 502 in FIGS. 5B and 5C. In operation 603, a first sacrificial oxide layer 105 a is disposed as shown in FIG. 6D. The operation 603 is similar to the operation 503 in FIG. 5D. In operation 604, several recesses 105 c are formed as shown in FIG. 6E. The operation 604 is similar to the operation 604 in FIG. 5E. In operation 605, a membrane 102 is disposed and patterned as shown in FIG. 6F. The operation 605 is similar to the operation 505 in FIG. 5F. In operation 606, a second sacrificial layer 105 b is disposed as shown in FIG. 6G. The operation 606 is similar to the operation 506 in FIG. 5G. In operation 607, several conductive plugs 103 are formed as shown in FIGS. 6H and 6I. The operation 607 is similar to the operation 507 in FIGS. 5H and 5I. In some embodiments, several standing off pads 103 a and semiconductive materials 103 b are disposed over the conductive plugs 103.

In operation 608, a second substrate 201 is provided or received as shown in FIG. 6J. In some embodiments, the second substrate 201 includes several active devices such as CMOS device. In some embodiments, the second substrate 201 is a CMOS substrate. In some embodiments, the second substrate 201 includes a passivation 203 disposed over the second substrate 201 and several bond pads 202 disposed over the passivation 203. In some embodiments, the bond pads 202 are surrounded by the passivation 203. In some embodiments, a top surface of the bond pad 202 is exposed from the passivation 203. In some embodiments, the bond pads 202 are configured to receive external interconnect structure in order to electrically connect circuitry in the second substrate 201 with another substrate.

In operation 609, some portions of the passivation 203 are removed as shown in FIG. 6K. In some embodiments, some portions of the passivation 203 are removed by any suitable operations such as photolithography and etching.

In operation 610, a protective layer 205 is disposed over the passivation 203, the bond pads 202 and the second substrate 201 as shown in FIG. 6L. In some embodiments, the protective layer 205 is configured to prevent the second substrate 201, the passivation 203, the bond pad 202 or other components disposed over the second substrate 201 from being etched or removed. In some embodiments, the protective layer 205 is an etching stop layer to prevent the second substrate 201 and the components disposed over the second substrate 201 from being attacked by hydrofluoric acid vapor. In some embodiments, an additional oxide layer 206 is disposed over the protective layer 205 as shown in FIG. 6M. In some embodiments, the protective layer 205 and the additional oxide layer 206 disposed on the bond pads 202 are removed as shown in FIG. 6N. The bond pads 202 are exposed from the passivation 203, the protective layer 205 and the additional oxide layer 206.

In operation 611, the conductive plugs 103 are bonded with the bond pads 202 as shown in FIG. 6O. In some embodiments, the first substrate 106 is flipped and then the conductive plugs 103 are bonded with the bond pads 202. The first substrate 106 is bonded with the second substrate 201 by the conductive plugs 103 and the bond pads 202, such that the first substrate 106, the plate 101, the membrane 102 and the second substrate 201 are electrically connected. In some embodiments, the standing off pads 103 a or the semiconductive materials 103 b are bonded with the bond pads 202.

In operation 612, the first substrate 106 is removed and the second substrate 201 is thinned down as shown in FIG. 6P. In some embodiments, the first substrate 106 and the second substrate 201 are thinned down in thickness, and the first substrate 106 is removed. In some embodiments, the first substrate 106 and the second substrate 201 are thinned down by grinding operations. In some embodiments, the first substrate 106 is removed by grinding or etching operations. In some embodiments, the first substrate 106 is thinned down or removed by dry or wet etching. In some embodiments, the dry or wet etching of the first substrate 106 is stopped at the buried oxide layer 101-1. In some embodiments, the second substrate 201 is thinned down from the thickness of about 800 um to about 200 um.

In operation 613, the plate 101 is patterned as shown in FIG. 6Q. The plate 101 is patterned to form several apertures 101 a. The operation 613 is similar to the operation 509 in FIG. 5L.

In operation 614, the first sacrificial oxide layer 105 a, the second sacrificial oxide layer 105 b and some portions of the second substrate 201 are removed as shown in FIG. 6R. In some embodiments, a first cavity 104 is formed by removing the first sacrificial oxide layer 105 a, the second sacrificial oxide layer 105 b. In some embodiments, a second cavity 204 is formed by removing some portions of the second substrate 201, some portions of the protective layer 205 and the additional oxide layer 206. In some embodiments, the second cavity 204 passes through the second substrate 201 and the passivation 203. In some embodiments, the second cavity 204 is aligned with the first cavity 104.

In some embodiments, some portions of the first sacrificial oxide layer 105 a and the second sacrificial oxide layer 105 b are remained. The remained first sacrificial oxide layer 105 a and the second sacrificial oxide layer 105 b as an oxide 105 surround the conductive plugs 103. In some embodiments, the plate 101 and the membrane 102 are supported by the conductive plugs 103 and the oxide 105.

In some embodiments, a monolithic sensor 300 is formed. The monolithic sensor 300 includes a semiconductor structure 100 and a semiconductor structure 200. The semiconductor structure 100 and the semiconductor structure 200 have similar configuration as in FIG. 4. In some embodiments, the plate 101, the membrane 102, the conductive plug 103, the oxide 105, the second substrate 201, the bond pad 202, the passivation 203 and the protective layer 205 have similar configuration as in FIG. 4.

The membrane 102 is displaceable relative to the plate 101 after the removal of the first sacrificial oxide layer 105 a and the second sacrificial oxide layer 105 b. In some embodiments, the membrane 102 is configured to sense an acoustic pressure. When the membrane 102 is displaced by an acoustic pressure, the displacement of the membrane 102 relative to the plate 101 is converted into an electrical signal corresponding to a magnitude and frequency of the displacement. The electrical signal is generated by the active device and the circuitry over the second substrate 201.

In the present disclosure, an improved semiconductor structure is disclosed. The semiconductor structure includes a plate which is an epitaxial (EPI) silicon layer or a silicon-on-insulator (SOI) substrate. The plate including the EPI silicon layer or SOI substrate is very thin while has sufficient rigidity for resisting residual stress developed during manufacturing and the acoustic pressure striking thereon. Thus, a noise is reduced, the SNR is increased. Furthermore, a handle substrate (such as silicon substrate) is ultimately removed. As such, an overall thickness of the semiconductor structure is reduced.

In some embodiments, a semiconductor structure includes a first device and a second device. The first device includes a plate including a plurality of apertures, a membrane disposed opposite to the plate and including a plurality of corrugations facing the plurality of apertures, and a conductive plug extending from the plate through the membrane. The second device includes a substrate and a bond pad disposed over the substrate, wherein the conductive plug is bonded with the bond pad to integrate the first device with the second device, and the plate is an epitaxial (EPI) silicon layer or a silicon-on-insulator (SOI) substrate.

In some embodiments, the plate has a thickness of about 0.3 um to about 20 um. In some embodiments, the first device is flipped and disposed over the second device. In some embodiments, the plate is disposed away from the membrane in a distance of about 0.3 um to about 5 um. In some embodiments, the membrane is sensitive to an acoustic pressure and is displaceable relative to the plate and within a cavity defined by the plate and the conductive plug. In some embodiments, the membrane or the conductive plug includes polysilicon. In some embodiments, the semiconductor structure further includes an oxide disposed around the conductive plug and a peripheral portion of the membrane. In some embodiments, the semiconductor structure further includes an anti-stiction coating disposed over the plate or the membrane to prevent or reduce stiction between the plate and the membrane. In some embodiments, the semiconductor structure further includes a semiconductive material disposed over the conductive plug.

In some embodiments, a monolithic sensor includes a micro-electro mechanical system (MEMS) device and a complementary metal oxide semiconductor (CMOS) device. The MEMS device includes a plate including a plurality of apertures, a membrane disposed opposite to the plate, including a plurality of corrugations facing the plurality of apertures, a conductive plug extending from the plate through the membrane, and a first cavity defined by the plate and the conductive plug. The CMOS device includes a substrate, a passivation disposed over the substrate, a bond pad surrounded by the passivation and bonded with the conductive plug, and a second cavity disposed over the first cavity and passed through the substrate and the passivation, wherein a displacement of the membrane by an acoustic pressure entering from the second cavity and impinged on the membrane is converted to an electrical signal by the CMOS device, and the plate is an epitaxial (EPI) silicon layer or a silicon-on-insulator (SOI) substrate.

In some embodiments, the membrane is disposed away from the passivation in a distance of about 1 um to about 5 um. In some embodiments, In some embodiments, the displacement of the membrane varies a capacitance between the plate and the membrane, thereby the electrical signal is generated by the CMOS device. In some embodiments, the plate is stationary. In some embodiments, the plate includes polysilicon-oxide-silicon substrate.

In some embodiments, a method of manufacturing a semiconductor structure includes providing a first substrate, disposing a plate over the first substrate, disposing a first sacrificial oxide layer over the plate, forming a plurality of recesses over a surface of the first sacrificial oxide layer, disposing and patterning a membrane over the first sacrificial oxide layer, disposing a second sacrificial oxide layer surrounding the membrane and over the first sacrificial oxide layer, forming a plurality of conductive plugs passing through the first sacrificial oxide layer or the second sacrificial oxide layer ,removing the first substrate, patterning the plate, and removing the first sacrificial oxide layer and the second sacrificial oxide layer to form a first cavity.

In some embodiments, the patterning the plate includes forming a plurality of apertures passing through the plate and aligned with the first cavity. In some embodiments, the disposing and patterning the membrane includes forming a plurality of corrugations aligned with the first cavity. In some embodiments, some portions of the first sacrificial oxide layer and some portions of the second sacrificial oxide layer surrounded by the plurality of conductive plugs are remained after the removing the first sacrificial oxide layer and the second sacrificial oxide layer. In some embodiments, the method further includes converting a displacement of the membrane relative to the plate to an electrical signal corresponding to a magnitude and frequency of the displacement. In some embodiments, the method further includes providing a second substrate including a passivation disposed thereon, and removing some portions of the second substrate and some portions of the passivation to form a second cavity passing through the passivation and the substrate, wherein the second cavity is aligned with the first cavity. In some embodiments, the method further includes providing a second substrate including a plurality of bond pads surrounded by a passivation, flipping the first substrate, bonding the first substrate with the second substrate by the plurality of bond pads and the plurality of conductive plugs, and thinning down the first substrate and the second substrate.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure. 

1. A semiconductor structure, comprising: a first device comprising: a plate including a plurality of apertures; a membrane disposed opposite to the plate and including a plurality of corrugations facing the plurality of apertures, and a conductive plug extending from the plate through the membrane; and a second device comprising: a substrate; and a bond pad disposed over the substrate, wherein the conductive plug is bonded with the bond pad to integrate the first device with the second device, and the plate is an epitaxial (EPI) silicon layer or a silicon-on-insulator (SOI) substrate.
 2. The semiconductor structure of claim 1, wherein the plate has a thickness of about 0.3 um to about 20 um.
 3. The semiconductor structure of claim 1, wherein the plate is disposed away from the membrane in a distance of about 0.3 um to about 5 um.
 4. The semiconductor structure of claim 1, wherein the membrane is sensitive to an acoustic pressure and is displaceable relative to the plate and within a cavity defined by the plate and the conductive plug.
 5. The semiconductor structure of claim 1, wherein the membrane or the conductive plug includes polysilicon.
 6. The semiconductor structure of claim 1, further comprising an oxide disposed around the conductive plug and a peripheral portion of the membrane.
 7. The semiconductor structure of claim 1, further comprising an anti-stiction coating disposed over the plate or the membrane to prevent or reduce stiction between the plate and the membrane.
 8. The semiconductor structure of claim 1, further comprising a semiconductive material disposed over the conductive plug.
 9. A monolithic sensor, comprising: a micro-electro mechanical system (MEMS) device comprising: a plate including a plurality of apertures; a membrane disposed opposite to the plate, including a plurality of corrugations facing the plurality of apertures; a conductive plug extending from the plate through the membrane, and a first cavity defined by the plate and the conductive plug; a complementary metal oxide semiconductor (CMOS) device comprising: a substrate; a passivation disposed over the substrate; a bond pad surrounded by the passivation and bonded with the conductive plug, and a second cavity disposed over the first cavity and passed through the substrate and the passivation, wherein a displacement of the membrane by an acoustic pressure entering from the second cavity and impinged on the membrane is converted to an electrical signal by the CMOS device, and the plate is an epitaxial (EPI) silicon layer or a silicon-on-insulator (SOI) substrate.
 10. The monolithic sensor of claim 9, wherein the membrane is disposed away from the passivation in a distance of about 0.3 um to about 10 um.
 11. The monolithic sensor of claim 9, wherein the displacement of the membrane varies a capacitance between the plate and the membrane, thereby the electrical signal is generated by the CMOS device.
 12. The monolithic sensor of claim 9, wherein the plate is stationary.
 13. The monolithic sensor of claim 9, wherein the plate includes polysilicon-oxide-silicon substrate.
 14. A method of manufacturing a semiconductor structure, comprising: providing a first substrate; disposing a plate over the first substrate; disposing a first sacrificial oxide layer over the plate; forming a plurality of recesses over a surface of the first sacrificial oxide layer; disposing and patterning a membrane over the first sacrificial oxide layer; disposing a second sacrificial oxide layer surrounding the membrane and over the first sacrificial oxide layer; forming a plurality of conductive plugs passing through the first sacrificial oxide layer or the second sacrificial oxide layer; removing the first substrate; patterning the plate, and removing the first sacrificial oxide layer and the second sacrificial oxide layer to form a first cavity.
 15. The method of claim 14, wherein the patterning the plate includes forming a plurality of apertures passing through the plate and aligned with the first cavity.
 16. The method of claim 14, wherein the disposing and patterning the membrane includes forming a plurality of corrugations aligned with the first cavity.
 17. The method of claim 14, wherein some portions of the first sacrificial oxide layer and some portions of the second sacrificial oxide layer surrounded by the plurality of conductive plugs are remained after the removing the first sacrificial oxide layer and the second sacrificial oxide layer.
 18. The method of claim 14, further comprising converting a displacement of the membrane relative to the plate to an electrical signal corresponding to a magnitude and frequency of the displacement.
 19. The method of claim 14, further comprising: providing a second substrate including a passivation disposed thereon, and removing some portions of the second substrate and some portions of the passivation to form a second cavity passing through the passivation and the substrate, wherein the second cavity is aligned with the first cavity.
 20. The method of claim 14, further comprising: providing a second substrate including a plurality of bond pads surrounded by a passivation; flipping the first substrate; bonding the first substrate with the second substrate by the plurality of bond pads and the plurality of conductive plugs, and thinning down the first substrate and the second substrate. 